Three-dimensional multiple bin-size bin packing problem with temperature layer and refrigerant loading constraints

SHEN Ni, XIA Jianan, MA Hong, LIU Yu

Systems Engineering - Theory & Practice ›› 2025, Vol. 45 ›› Issue (2) : 685-701.

PDF(730 KB)
中国科学院数学与系统科学研究院期刊网
PDF(730 KB)
Systems Engineering - Theory & Practice ›› 2025, Vol. 45 ›› Issue (2) : 685-701. DOI: 10.12011/SETP2023-1976

Three-dimensional multiple bin-size bin packing problem with temperature layer and refrigerant loading constraints

  • {{article.zuoZhe_EN}}
Author information +
History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

EndNote

Ris (Procite)

Bibtex

Download Citations
{{article.zuoZheEn_L}}. {{article.title_en}}. Systems Engineering - Theory & Practice, 2025, 45(2): 685-701 https://doi.org/10.12011/SETP2023-1976

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}
{{article.copyrightLicense_en}}
PDF(730 KB)

Accesses

Citation

Detail
Sections
Recommended

/

〈 〉